Because of the need for consistent, in-person collaboration and/or the requirement to perform all work onsite due to the nature of this particular role, it will be performed full-time on site. This means work will be conducted on location at a BAE Systems facility 100 of the time.

Our employees work on the world’s most advanced electronics. At Electronic Systems, you’ll be among the brightest minds, working on the aerospace and defense industry’s most difficult problems. Drawing strength from our differences, we’re innovating for the future. And you can, too. We put our customers first – exemplified by our missions: “We Protect Those Who Protect Us®” and “We Innovate For Those Who Move The World™.” Sound like a team you want to be a part of? Come build your career with BAE Systems.

We are seeking a skilled Reworker to join our team, responsible for reworking modules that do not meet specifications by removing and replacing faulty components, cleaning foreign object debris (FOD), and performing wire replacements. The ideal candidate will have experience working with complex micro-integrated circuit modules and microwave/RF integrated circuit modules.

Key Responsibilities:

• Remove and replace defective components from modules
• Clean foreign object debris (FOD) from modules
• Perform wire replacements as needed
• Troubleshoot and repair defective modules to ensure they meet specifications

Requirements:

• Experience working with complex micro-integrated circuit modules and microwave/RF integrated circuit modules
• Familiarity with substrate attach (duroid/ceramic), MMICs, ICs, caps, diodes, and resistors
• Soldering skills and experience with eutectic die attach
• Ability to work with a variety of adhesives and epoxies
• Familiarity with operating manual and automatic bonding equipment (e.g., K+S, MEI, Westbond, and Hy-Bond)
• Ability to work with a microscope for extended periods
• Understanding of MIL-STD-883 and complex microwave module bonding

Preferred Qualifications:

• Experience with lamination presses, bladder bag ovens, and epoxies
• Familiarity with MRSI 505 and 605 equipment
• Experience with manual gold ball and ribbon bonding
• Knowledge of automatic bonding equipment (e.g., Palomar 2460/8000 ball bonders and H+K wedge bonders)

Working Conditions:

• Work in a cleanroom or laboratory environment
• Use a microscope for extended periods
• Wear protective gear (e.g., gloves, safety glasses) as required